With an expansive substrate portfolio, ASE Material enables our customers to select the materials that best meets their device and budget requirements. From flip chip to wire bond substrates, ASE Material combines the technology, the technical support, and the world-class customer service that give customers the competitive advantage they need to lead the industry.

Our materials are of particular use in the property area. If you are letting a property then our materials are very good for the maintenance of that property, Ground Rent and Ground Rents can be acquired and set up for your letting property. Freehold ground rents can be obtained to lease a property.

Our customers can select the ASE Material substrate built to meet the specific needs of graphics, chipsets, application-specific integrated circuits (ASICs), and system-on-chip (SoC) devices as well as ICs for consumer, communications and computing applications.

Our market understanding, complemented by our broad product portfolio, make ASE Material an ideal choice for integrated device manufacturers (IDMs) and fabless semiconductor companies worldwide as they seek to address their semiconductor packaging material needs.

ASE Material is ISO-9002 Certified, ISO-14001 Certified, QS-9000 Certified, and TS 16949 Certified.

ASE Material provides the design and production of interconnect materials, such as substrates, used in the packaging of semiconductors. With a commitment to applying innovative technology to lower excessive substrate costs, ASE Material delivers competitive cost and performance advantages to integrated device manufacturers (IDMs) and fabless chip companies worldwide.

Recognizing the need for a reliable material supplier, ASE Material was established in 1995 in Kaohsiung, Taiwan where operations began with the development of etched leadframes. Three years later, ASE Material entered the laminate substrate market and has since grown to become the largest PBGA substrate supplier in the industry (Prismark March 2005). In 2003, ASE Material began high-volume production of flip chip build-up substrates at its state-of-the-art facility in Chung-Li, Taiwan.

The company is focused on the research and development of advanced substrate technology for lower cost, higher performance, and environmentally compatible IC package solutions. By applying leading-edge technology, ASE Material delivers significant economic and performance advantages to the foremost semiconductor companies worldwide.

Interconnect material cost is now the biggest component in the total cost of a package. The integration of material operations into the ASE value chain greatly enhances our value proposition for customers. By expanding our material manufacturing capacity, ASE provides a more attractive cost solution for our customers.